Epson Plating Division - Company Profile

Our Commitment
	"Working under the "Exceed Your Vision" tagline, Epson is determined to constantly responds to the changes in the market demand, conditions and trends by tapping into its store of creativity and technical knowledge of each individual. Epson aims to stay ahead of competition through provision of quality services and products that exceeds customers' expectations and by practising Corporate Social Responsibility." Singapore Epson Industrial Pte Ltd (Plating Division) General Manager John Loh Kwong Yong

Company Profile

Singapore Epson Industrial - Plating Division

Singapore Epson Industrial - Main Plant

Plating Plant Address	Singapore Epson Industrial Pte Ltd (Plating Plant) 86 & 88, Second Lok Yang Road, Jurong, Singapore 628162
Main Plant Address	Singapore Epson Industrial Pte Ltd (Main Plant) 1 Tuas Link 4, Singapore 637898
Contact	Tel: +65 62682164 Fax: +65 62653566
Establishment	1979
Number of employees	197
Business Type	Plating, Surface Engineering Plating Types: Chrome, Zinc, Copper, Nickel, Tin, Gold, Silver, Platinum, Rhodium, Palladium, ENIG, PVD (Physical Vapor Deposition), AR (Anti-Reflective) Coating. Functional Plating: Alloy plating, composite plating. Industrial Segments Aerospace Industry, Automobile Industry, Electronics Industry, Medical Devices Industry, Watch Industry, Semiconductor Industry, Oil and Gas Industry Environmental Technology Waste EN Recovery System Waste Water Recycle System Potassium Permanganate KMnO₄ Reuse Technologies Waste Ink Process System HCl Recycle System Solar Energy Regenaration System
International Standard	ISO 9001 ISO 14001 IATF 16949

Company Milestone

Asian Precision Singapore

May 1979	Asian Precision(S), APS formed to provide plating for TPL.
1988	Started plating/surface treatment business for watch movement parts.
Oct 1992	APS was unified with TPL & EPS to form SEP Group.
May 1995	Started IC Automated Lead frame plating.
1996	ISO9000 Certification.
Dec 1998	ISO14001 Certification.
Mar 2000	Patented Watch product Word Index E-Coating technology.
Jan 2001	Started "Lead free" IC Lead Frame Plating (Fully Automation).
Feb 2001	Established Plating for Chip Scale Packaging SAW in Clean room.
Mar 2001	Patented Composite E-Coat Technology (Using for printer Shaft).
May 2002	Established new water treatment technology to treat Industrial water to DI water & won SEC Environment Award Level I.
Apr 2003	Set up Super-Precision(sub-µm) plating for HDD FDB Part.
Jun 2003	Establish bondable Electroless Gold(>0.5µm)plating for PCB.
Nov 2003	Upgraded to ISO9001:2000 Certification.
Apr 2004	Factory area expansion.
2007	Established PVD Coating Technology.
July 2009	Factory area expansion.
Dec 2009	IATF16949:2016 Certification.
Sept 2013	Awarded PUB WEB Silver Award
Feb 2014	Certified SS 577
Sept 2014	Awarded PUB WEB Gold Award

Company Facilities
Class1000 Cleanroom	Aerospace Parts Plating Equipment	Semi-Automated Plating Line	Heat Treatment Room
Automated Plating on Ceramics	Plating for Watches	PVD Facility	Epson Plating Division also has the following facilities: Flex Tape Plating in Cleanroom Semiconductor Wafer Plating in Cleanroom Anti-Relective Optical Coating in Cleanroom Fully Automated Selective Gold Plating Line Non-Bath System Selective Silver Plating Line