DIAMOND SAW CUTTER  |  CROSS SECTION POLISHER  |  POLISHER AND GRINDER  |


 

 

DIAMOND SAW CUTTERDiamond Saw Cutter

 

** Now Constructing **

 

 

 

 

CROSS SECTION POLISHERCROSS SECTION POLISHER


In the CP, a shielding plate is mounted on the upper portion of the specimen, and then the portion protruding from the shielding plate is irradiated with a Broad Argon Ion Beam, this procedure enables a cross section to be prepared along the edge of the shielding plate. Compared with mechanical polishing, the CP easily creates a highly uniform cross section with no strain caused by milling.


Specifications

Gas for ion Argon gas
Gas flow control Mass flow controller
Pressure measurement Penning gauge
Evacuation equipment Turbo molecular pump. Rotary pump

 

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POLISHER AND GRINDERPOLISHER AND GRINDER


Main Applications


  1. Sample preparation by grinding and polishing are used to create a flat, defect-free surface
  2. For examination of a metal's microstructure under a microscope .
  3. For checking the thickness of plating layer.

 

Specifications

  • 8" (203mm) or 10" (254mm) grinder/polisher
  • Quiet belt drive systems 
  • Upgrade to Semi-automatic systems with addition of Vector or Vector LC Power Head.


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