Added! Under Bump Metallization (UBM) Technology
Singapore Epson Industrial Plating Division has added UBM or Under Bump Metallization Technology into Our Semiconductor Industrial Sector. As Silicon System Groups put its "A growing number of advanced semiconductor devices are fabricated today using under bump metallization (UBM)". With this technology, it can be either deposited in the conventional wafer fab or in the assembly and testing of semiconductors.