15th International Conference on Electronic Packaging Technology (ICEPT 2014)
Our affiliated company, Epson Surface Engineering (Zhenjiang) will be taking part in the 15th International Conference on Electronic Packaging Technology (ICEPT 2014) held at Chengdu, China.
Our affiliated company, Epson Surface Engineering (Zhenjiang) will be taking part in the 15th International Conference on Electronic Packaging Technology (ICEPT 2014) held at Chengdu, China, from August 12 to 15, 2014. Hosted by Chinese Institute of Electronics (CIE) and organized by Electronic Manufacturing and Packaging Technology Society (EMPT) of CIE and University of Electronic Science and Technology of China, we will be presenting on the development of Au Sn plating for semiconductor industry. More details here...