Epson Plating Division - Unique Technology

Singapore Epson Industrial Plating Division offers unique plating technology for various industries. Each plating method is customised to meet various sizes of different parts. Because we follow strict specifications according to customer requirements with our advanced technology, this is how we differentiate ourselves and in the operation process reducing harmful effects to the environment.

Read how we managed to reduced harmful environmental effects here

  Selective Plating Technology
Epson Selective Plating Masking
Reusable, Easy Handling Masking Used During Plating Process.
The main use of selective plating is to focus plating on the functional area, thus bringing down plating costs. The area of a part not to be plated is masked so that it is not plated. Epson is currently providing two types of selective plating: nickel and silver. We also work closely with our customers to provide customized solutions that meet and exceed their expectations. r
Selective Nickel Plating
Selective nickel plating is used for high-pressure turbine support assemblies, which are plated at a minimum thickness of 500µm. Unplated areas are masked with masking tape during the plating process.

Main Application/Advantages
Epson has developed a new plating production line concept that reduces the time taken from days to hours, uses a smaller solution tank and delivers better quality.

Please refer to the relevant pages
Aerospace IndustryNickel Plating

Non-Bath Selective Plating (NBS)
Non-bath selective plating (NBS) is performed using Epson's self-designed machine, which has a solution agitation system specialized for selective plating. The internal diameter of the part to be plated is used as a bath, while any non-plated areas are covered with a rubber mask. The bath level is automatically controlled and the loading jig and rubber mask are specially designed to cater to different sizes.

Main Application/Advantages
NBS is used for selective silver plating. Using this method allows the special anode to control the distribution of the plating thickness, from 1~50 µm. NBS also helps to conserve chemicals and energy, thus making it environmentally friendly.

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Oil and Gas IndustrySilver Plating
  Wet and Dry Combined Deposition Techology
LED Bulb
Three Layered Plating
The combination of both wet and dry deposition technique, this unique technology is plating three layers on a non-metallic substrate, currently used in the semiconductor industry. This unique technology is a One-Stop plating services provided by Singapore Epson Industrial Plating Division.

A Vacuum deposition acts as a seed layer is plated on non-metallic surfaces to allow further surface processing. This combination tTechnology allows Singapore Epson Industrial Plating Division to provide customers with unique and customised plating solutions.


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Semiconductor Industry
  Waste Water Reycling System
混合动力技术 Plating can be used in a variety of environmental control systems related to waste water treatment, including DI systems and water recycling systems.

Epson's cyanide treatment line is used to treat all cyanide, gold and alkaline waste from production, and can treat approximately 222m3 of waste daily. Epson also has a heavy metal treatment line to treat all metallic and acidic production waste, and can treat approximately 278m3 of waste daily. These systems allow users to maintain trade effluent treatment facilities in good order and allow for quality trade effluent that exceeds PUB's regulatory and environmental requirements. Epson is working to improve the current chemical coagulation to electro-coagulation method for waste water treatment in order to minimise chemical usage and waste.

Another system that Epson has developed is the DI system, which has been used as the feed source for water generation. The system is able to generate three different types of DI water (RO, LP and HP) to meet production needs using Ultra Filtration and an RO system. The DI system can produce approximately 528m3 with less than 20us of quality water daily to ensure an uninterrupted quantity and quality of DI water supply. -> µS (micro Siemens)

Epson's in-house water recycling system has proved to be a cost-effective and efficient way to reduce our water consumption. The system minimises chemical usage and the strain on natural resources, conforming to Seiko Epson's environmental policies and focus on water conservation. The result has been an approximately 40% recycling rate for production waste water. In addition, we also have a rainwater collection project in place. Epson is currently working to achieve zero trade effluent discharge by recycling all effluent.
Epson Waste Water Recycle Technology
Operation Process