Introduction
ENIG plating (electroless nickel and immersion gold plating) uses a fully automated plating system that progressively plates electroless nickel followed by immersion gold on a PCB board. ENIG plating gives consistent plating thickness and a high quality final product.
Main Application and / Advantages
- ENIG plating is mainly used for wire bonding and SMT processing for PCB. Through electroless nickel auto analysis and an auto top-up system, a consistent thickness can be achieved. In addition, the process establishes a high thickness bondable immersion for PCB. Using ENIG plating, it is possible to achieve process stability, high quality and high productivity.
Generic Process Flow
