Semicon Singapore 2014
Singapore Epson Industrial (Plating Division) had exhibited during the "SEMICON Singapore 2014" held at Marina Bay Sands Expo & Convention Center from the 23 - 25 April 2014.
Held annually, SEMICON Singapore 2014 quoted it as "the only microelectronics trade and technology event in Southeast Asia." During the 3 days, Singapore Epson Industrial (Plating Division) had showcased its plating technology for the semiconductor industry on Under Bump Metalisation (UBM), Au80Sn20 Alloy Plating, Encapsulation for SAW Package and more.
SEMICON Singapore 2014 attracted visitors from various countries across the region, and Singapore Epson Industrial (Plating Division) was able to make its presence to the various companies across the region.