Sputtering
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The Multi-target sputtering system designed with multi-targets (4 targets) inside the process chamber, suitable for R&D, prototype sputtering or small scale production for wafer and panel products.
Machine is also configured with a load lock, which enable users to load/unload products without breaking the vacuum of process chamber
| Multi-Target Sputtering– Specification |
Coating Specification :-
1. Coating material: Ti, Cu, Al, Ni, TiW, Ta, Cr etc.
2. Maximum heating temperature (500°C ± 1%)
3. Sputtering layer thickness uniformity ± 5%
Application:
1. Metal layer sputtering for wafer and panel products
2. Hole filling for wafer and panel products
3. Reactive sputtering for dielectric thin film layer for wafer and panel products
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| Multi-Target Sputtering– Benefits |
1. Suitable for multilayer sputtering without breaking vacuum (4 targets in chamber)
2. Equipped with high-magnetic cathode plate to sputter Ni and other ferromagnetic material
3. High flexibility for different product size or coating specification
Multi-target Sputtering Machine
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