A wide range of plating types are used in the electronics industry. These include gold, electrolytic and electroless nickel, palladium nickel, tin, and ENIG plating. These plating techniques are used in the production of such products as hard disks, probe testers, PCBs, battery contacts and resistors.
Multi-Layer Alloy Plating for functional resistive film. Superior Adhesion over Ceramics, Stable Plating Speed, Excellent Resistance Value
Size
1S, 2S, 3S, 5S, 12S
Substrate
Ceramic
Metallization
Ni-Cu Alloy
Thickness
6 - 30 µm
Multi-Layered Copper / Nickel Alloy Plating with High Adhesion and Resistance Properties.
As Electroless Ni-Au Substitute, ENIG Shows More Advantages. Mainly Used in Electronic Products, Wire Bonding and Solder Connections.
Substrate
PCB Board, Copper
Metallization
ENIG
Thickness
Au: 0.05 - 0.1 µm
Ni: >6 µm
Uneven Plating Surface, Short Lifespan and Treatment for EN Solutions, and Copper Contamination.
High Precision Replenishment Column System for good chemical control process
Auto Chemical Analysis and Control System for precision chemical control with Cpk above 1.33
Reel-to-Reel FPC Conducting Continuous Plating has Broad Prospects for Development of Surface Treatment Technology and Solutions. Developed Electrolytic Tin to Replace Immersion Tin on Flex Tape, it has Better Quality and Reduced Tin Whiskers.
Substrate
Polyimide
Metallization
Electrolytic Tin
Thickness
0.2 ~ 0.5 µm
Reduced Uneven Plating Surface, Improving Chemical Lifespan and Reduced Copper Contamination.
Sn Lump Inside Bump is < 5 µm
No Whiskers Found More Than 4 Months
Plating Done For Spindle Motor of Computer Hard Disks.
Size
0.85", 1.0", 1.8", 2.5", 3.5"
Substrate
Ceramic
Metallization
EN
Thickness
Controlled within 20nm
Precise Plating Thickness Controlled in Nano-meter
Plated Area
