In the semiconductor industry, gold and electroless nickel plating are applied to reflector rings, reflector arrays and top chucks. Gold is used because of its reflectivity, conductivity and heat dissipation qualities. Electroless nickel is valued for its evenness and chemical resistance.
Unique Plating Technology for Microelectronics
For Use in 3G Mobile Phones, Bluetooth Devices, Radio Frequency Packages and Wireless Components.
Unique Plating Technology Specifications
Size
4”(Square Wafers)
Substrate
Ceramic
Metallization
Ti-Cu + EN / Cu (To prevent electromagnetics and corrosion)
Sputtering Thickness
Ti: 10µm, Cu: 50µm
Thickness
3.5 - 100µm
Technical Challenges
Seed Layer + EN
Layer 1: Sputtered Ti
(PVD) Layer 2: Sputtered Cu (PVD) Layer 3:
Electroless
Ni Adhesion on Molding compound
Seed Layer + Cu
Sputtering of Titanium Oxide
Copper Patterning
Copper Pillars with
Roundness via Hole Filling
Related Pages
Under Bump Metalisation (UBM)
For Connecting a Semiconductor Device to the Packaging Substrate.
Unique Plating Technology Specifications
Size
4", 6", 8" (Round Wafer)
Substrate
Ceramic, Al-Si
Metallization
Ti, Cu, Ni, Au, Ag, Cr
Technical Challenges
To Provide Excellent Adhesion to Variety of Wafers.
Metal Diffusion Prevention.
Plating Technology for Wafers
Used in LEDs and Semiconductor Wafers in wireless mobile telecommunications technology.
Unique Plating Technology Specifications
Size
3", 4", 5", 6", 8" (Round Wafer)
4" (Square Wafer)
Substrate
Ceramic, Al-Si
Metallization
Au, Black Ni, Au-Sn, Au-Ni, Si, Cu
Thickness
0.1 - 100µm
Technical Challenges
Encapsulation Plating on SAW Devices
Copper / Black Nickel Multilayer Plating on (CSSP
SAW) Filters Challenges Encapsulate over the
Package, Protecting Against Humidity,
Electromagnetic Induction and oxidation. Intensity
of Black is Required as A Detector in Laser Marking.
Cu Plating on SAW Devices
Copper Plating on SAW Filters Even Thickness
Distribution
Au-Sn Alloy Plating On Wafer
Limited Chemical Life Span, Color and Composition
uniformity
Wafer Au Plating
Adhesion on Si/Al Alloy Materials, Surface Roughness
Improvement on Roughness and Adhesion using PVD and
Electroplating.
Related Pages
Plating Technology for RF Packages
RF Packages in Satellites, Base Stations and Other Communication Devices
Unique Plating Technology Specifications
Substrate
Ceramic, Cu-Mo, Cu, Cu-W
Metallization
Ni-Co / Au
Thickness
1.5 - 3.5µm
Technical Challenges
Plate uniform Au (Ni±0.9μm Au±0.23μm) on 2 different
thickness parts which separated by Ceramic.
Selective Lids Plating on New Models of Holy Lids and
Ceramics
