News
Apr 20, 2024
Gold Tin plating deposited a thin layer of of Au Sn Alloy
(80/20) onto the surface by electroplating process,
resulting in a matte silvery finish.
Gold Tin (AuSn) solder is essential in electronic soldering,
known for its versatility in application methods such as
preforms, solder paste, sequential evaporation, and
electro-deposition.
Our advanced electroplating process is a cost-effective
solution, delivering unparalleled thickness and positional
control, along with superior bonding reliability,
wettability, and creep resistance.
Application
- Die attach material.
- Chip bonding material for optoelectronic/microelectronic
devices.
- Lids for package sealing (hybrid, photonic,
microelectronic & photo electronic device etc).
