Epson Plating provides comprehensive solutions that are customized to meet your specific needs. From precision engineering and surface finishing to detailed analysis and sustainable environmental solutions, we are committed to delivering high-quality results across all aspects of your project. Our expertise ensures we help you achieve the best outcomes, efficiently and reliably.
Diamond Saw Cutter
The diamond saw cutter is used to precisely
section metal samples without causing structural
damage due to heat or deformation. It features a
thin blade embedded with industrial diamonds,
enabling accurate and clean cuts across a wide
range of materials. This tool is essential for
cutting various types of materials, whether
brittle or ductile, with minimal deformation.
These include metals, composites, laminates,
plastics, electronics, and biomaterials.
Diamond cutting is typically the first step in
sample preparation, performed before any grinding
or polishing, ensuring the integrity of the
material is preserved for further analysis.
Cross Section Polisher
The cross section polisher is a high-precision instrument, often using ion beam technology, to create ultra-flat surfaces. It’s especially useful for preparing detailed cross-sections of coatings, thin films, and interfaces in composite materials. This tool is essential for applications where traditional mechanical polishing might damage delicate structures.
Specifications
Gas for ion:
Argon gas
Gas flow control:
Mass flow controller
Pressure measurement:
Penning gauge
Evacuation equipment:
Turbo molecular pump. Rotary pump
Polisher And Grinder
After sectioning, the sample undergoes a series of grinding and polishing steps. The grinder uses abrasive surfaces to gradually remove surface irregularities and scratches. Following this, the polisher uses progressively finer abrasives to produce a mirror-like finish. This smooth
Main Application/Advantages
Sample preparation by grinding and polishing are used to create a flat, defect-free surface.
For examination of a metal's microstructure under a microscope.
For checking the thickness of plating layer.
Specifications
8" (203mm) or 10" (254mm) grinder/polisher
Quiet belt drive systems
Upgrade to Semi-automatic systems with addition of Vector or Vector LC Power Head.
