Microfabrication by Photo Chemical Etching Process is a highly precise, tightly controlled corrosion process used to produce complex metal components with very fine detail.
Epson drives to diversity into another novel business penetration, Chemical Machining, Selective Metal Coating, Lift-off Coating to create one stop services.
| Technology | Fabrication Type | Method | Substrate | General Line/Space Precision | |
|---|---|---|---|---|---|
| 1 | Chemical Machining | Etch | Control Depth Etching by Corrosive chemical |
|
25 µm |
| 2 | Selective Metal Coating (Spot shape / Strip form) | Deposition |
|
|
50 – 300 µm |
| 3 | Lift-off coating | Deposition | Photolithography dry film resist as sacrificial layer before sputtering |
|
50 – 300 µm |
| Item | Capabilities |
|---|---|
| Material Thickness | Min 0.050mm, Max 2.50mm |
| Material Size | Min 120mm, Max 500mm |
| Min Diameter | 0.030mm |
| Min Feature Resolution | 0.025mm |
| Min Feature Tolerance | 0.020mm |
| Pitch Tolerance | +/-0.010mm |
| Undercut or Bevel | Degree of Slope depends on half-etch depth |
| Tabs | Min 0.2 width |
