ENIG Plating
ENIG (Electroless Nickel Immersion Gold) is a widely used
metal plating process in the manufacture of printed circuit
boards (PCBs). This method deposits a thin layer of
electroless nickel followed by a layer of immersion gold,
providing a highly reliable, corrosion-resistant finish. The
resulting finish is ideal for enhancing the performance and
longevity of PCB contacts.
ENIG plating offers
superior surface planarity, making it a top choice for PCBs
with fine-pitch components. It's also fully compatible with
lead-free soldering processes, making it an excellent option
for industries that adhere to environmental regulations.
Additionally, ENIG plating ensures outstanding solderability
and is wire bondable, which is essential for
high-performance, long-lasting electronic connections.
Benefits
- Prevents Oxidation: Improves solderability and protects copper contacts and plated-through holes from oxidation.
- Excellent Surface Planarity: Ideal for PCBs with fine-pitch components, ensuring high-quality performance.
- Lead-Free Compatibility: Compatible with lead-free soldering processes, making it suitable for environmentally-conscious manufacturing.
- Enhanced Soldering and Wire Bonding: Provides excellent solderability and reliable wire bonding for robust connections.