Gold Plating
Gold plating is a widely used process for adding a layer of gold to a substrate, enhancing both the appearance and performance of a product. At Epson, we offer a diverse range of high-quality gold plating options tailored to meet your specific needs. Our gold plating services are ideal for decorative, functional, and electronic applications, and extend to various substrates, including flexible tapes, reel-to-reel (RTR) systems, and wafers.
Category
- Soft Gold: Ideal for applications where corrosion resistance and conductivity are key.
- Hard Gold: Offers increased wear resistance, perfect for applications with frequent contact or mechanical stress.
- Pink Gold: Provides a unique aesthetic, often used in decorative and jewellery applications.
- Immersion Gold: A thin gold coating used for high-precision electronics and connectors.
- Gold-Tin Alloy: Often used in semiconductor and soldering applications, providing excellent adhesion and conductivity.
Benefits
- Superior Conductivity: Enhances electrical conductivity, making it ideal for electronics and connectors.
- Corrosion Resistance: Offers excellent protection against oxidation and corrosion, ensuring longevity.
- Aesthetic Appeal: Provides a premium, attractive finish for decorative and functional components.
- Durability and Hardness: Hard gold plating is perfect for wear-resistant applications.
Plating Techniques
- Spot Plating: Precise plating on specific areas, minimizing gold usage while maintaining high-quality finishes.
- Brush Plating: Ideal for repairs or selective coating, offering a localized application of gold.
- Wafer Plating: Specifically designed for semiconductor applications, providing a uniform gold coating on wafers.
- Selective Plating: Targets specific areas for plating, offering cost-effective solutions without sacrificing quality.