Gold Tin Plating
Gold Tin plating deposited a thin layer of of Au Sn Alloy (80/20) onto the surface by electroplating process, resulting in a matte silvery finish.
Gold Tin (AuSn) solder is essential in electronic soldering, known for its versatility in application methods such as preforms, solder paste, sequential evaporation, and electro-deposition.
Our advanced electroplating process is a cost-effective solution, delivering unparalleled thickness and positional control, along with superior bonding reliability, wettability, and creep resistance.
Application
- Die attach material.
- Chip bonding material for optoelectronic/microelectronic devices.
- Lids for package sealing (hybrid, photonic, microelectronic & photo electronic device etc.)
|
Properties
|
S/N | ||
| 1 | Composition | Au80Sn20 (± 2 wt%) | |
| 2 | Thickness | 1~25 (± 10%) | |
| 3 | Coefficient of thermal expansion* | 16×10 | |
| 4 | Thermal conductivity | 57W | |
| 5 | Tensile strength | 275MPa | |
| 6 | Electrical resistivity | 16.4×10 |
| Features | Preforms | Evaporation | Electro-Plating |
|---|---|---|---|
| Cost (Relate to thickness) |
$$$ (High thickness 25pm) |
$$ (Coated waste in chamber) |
$ (Low thickness ~3pm) |
| Positional Accuracy | Not good | Good | Excellent |
| Productivity (UPH) | Low | High | Excellent |
Plating Method
| ITEM | DESCRIPTION |
|---|---|
| PLATING TYPE | WET DEPOSITION (WAFER LEVEL PLATING) |
| BASE MATERIALS | SILICON WAFERS WITH SEED LAYER |
| MAJOR APPLICATION | SOLDERING MATERIAL FOR FLIP CLIP PROCESSING |
| COATING CHARACTERISTIC / PROPERTIES | LOW MELTING TEMPERATURE COMPARED TO AU |
| WORK SIZE | WAFER SIZE: 4, 5, 6, 8 INCH |
| THICKNESS / COMPOSITION | AU-SN: 1~ 15 PM (±10%) / AU%: 80 WT% (±2%) |
| ENVIRONMENT | CLEANROOM CLASS: CLASS 10K (0.5PM) |