Singapore Epson Industrial Plating Division offers unique plating technology for various industries. Each plating method is customised to meet various sizes of different parts. Because we follow strict specifications according to customer requirements with our advanced technology, this is how we differentiate ourselves and in the operation process reducing harmful effects to the environment.
Read how we managed to reduced harmful environmental effects here.
SEMICON COMPONENT CLEANING
Welcome to EPSON forefront of precision parts cleaning tailored specifically for semiconductor parts. Parts cleaning is a crucial process in various industries, particularly in the semiconductor and precision manufacturing sectors, where the removal of contaminants is vital to ensure the optimal performance and longevity of components. This process involves the meticulous cleaning of parts to eliminate any residues, particles, or impurities that may interfere with their functionality or compromise their quality.
Incoming QC
Chemical Cleaning
Rinsing and Drying
Outgoing QC
Nitrogen Protection Packing
Capabilities
| Items | Capability |
|---|---|
| Facility – Cleanroom |
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| Facility – High Pure Water |
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| Quality Check Capability |
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| Cleaning Parts Material |
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| Cleaning Method |
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SELECTIVE REEL TO REEL PLATING ON CONNECTORS
Cutting edge Selective Reel to Reel Plating technology Presents Continuously-Reel Parts which delivering much high productivity, throughput and yields at competitive processing cost.
Specifications
| Item | Description |
|---|---|
| Plating materials | Ni, Hard Au, Soft Au, NiP, Sn, Indium |
| Plating type | Wet Deposition (Reel to Reel) |
| Base materials | Cu alloy and SUS |
| Major Application | Medical Diagnostic Meter, Pressure Sensor on Automotive, Micro Coaxial Connectors for computer laptop |
| Coating Characteristic | Corrosion Resistance, good bendability, good soldering |
| Work size | Width 15 ~ 80mm and Thickness 0.10 ~ 0.70mm in Roll form |
| Thickness | Hard/Soft Au/Pd: 0.010 ~ 1.500 µm, Ni, NiP, Sn and SnPb: 0.500 ~ 4.000 µm |
| Environment | Room temp, Controlled Storage Environment |
Features
- Narrow Thickness Plating Range
- Precision Selective Plating Area
- Good Flatness Maintained
- Real Time Parameter Monitoring
- AOI Auto Optical Inspection
- Digitalized Production Control
DLC - Diamond Like Carbon Coating
DLC COATING
DLC Coating– Specification
Coating Specification:
- Coating layer: interlayer + DLC or multi DLC layer etc.
- DLC Hardness : 1500 ~ 6000 HV
- Coating thickness: 0.5 um ~2um
- Low friction coefficient
Application:
- Black coating for watch bands, watch case etc
- Super hard DLC coating (6000HV) for cutting tools, drill bits and mould etc.
- Super hard DLC coating for mechanical parts like gears, shaft bearings
DLC Coating– Benefits
- Able to deposit DLC coating with extreme hardness and low friction coefficient for excellent wear resistance.
- Able to deposit DLC coating with excellent adhesion by introducing interlayers or optimizing DLC coating structures.
Multi-target Sputtering Machine
MULTI-TARGET SPUTTERING
The Multi-target sputtering system designed with multi-targets (4 targets) inside the process chamber, suitable for R&D, prototype sputtering or small scale production for wafer and panel products.
Machine is also configured with a load lock, which enable users to load/unload products without breaking the vacuum of process chamber
Specification
Coating Specification:
- Coating material: Ti, Cu, Al, Ni, TiW, Ta, Cr etc.
- Maximum heating temperature (500°C ± 1%)
- Sputtering layer thickness uniformity ± 5%
Application:
- Metal layer sputtering for wafer and panel products
- Hole filling for wafer and panel products
- Reactive sputtering for dielectric thin film layer for wafer and panel products
Benefits
- Suitable for multilayer sputtering without breaking vacuum (4 targets in chamber)
- Equipped with high-magnetic cathode plate to sputter Ni and other ferromagnetic material
- High flexibility for different product size or coating specification
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Before Drum Sputtering
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After Drum Sputtering
BARREL SPUTTERING
The barrel sputtering machine is designed with a rotating barrel in which products are loaded for sputtering process. The barrel sputtering process enables high loading quantity and great productivity for loose/small size metallisation.
Specifications
Coating Specification:
- Coating material: Ti, Cr, Cu, Ni, SUS…
- Maximum heating temperature: 300°C
- Residual gas analyser: ULVAC CGM
Application:
- Metallization for ceramic rod
- Metallization of ceramic or other material products with small part size
Benefits
- High productivity and loading volume for metallization of small size product such as ceramic rod.
- Metallization layer with excellent electronic functional performance compared with wet plating.
- Good thickness uniformity.
Vipor-Barrel
Vibro-Barrel Plating Line
VIBRATORY PLATING
We offers vibratory plating service to bulk process delicate work piece as alternative to barrel plating. Vibratory plating is designed to prevent entanglement, deformation, scratches and other mechanical defects on work piece. It is commonly employed in plating of pin, switch, connector and terminal.
Plating finishes available including nickel, silver, palladium and gold.
Concept
A vibration generator transmits oscillation pulses to the basket through the vertical shaft.
This vibration causes the parts to move slowly around the basket’s axis while gently being mixed and agitated.
The parts move over rows of cathode contact that located at the bottom of the basket, while maintaining electrical contact at all times.
There are plastic screens located at the bottom of the basket, which allow exchange of chemical solution. Thus, ensure constant current density and uniform plating.
Benefits
Reduces precious metal consumption
The vibratory action helps to dislodge trapped solution from the plated parts decreasing the amount of drag-out and increasing the effectiveness of the rinse cycles.
Eliminates part damage
A wide variety of part sizes and types can be plated in these units. The gentle vibratory action reduces tangling and protects small delicate parts from being bent, scratched, or otherwise damaged.
Minimizes drag-out
The vibratory action helps to dislodge trapped solution from the plated parts decreasing the amount of drag-out and increasing the effectiveness of the rinse cycles.
Vibration improve parts lapping defects
The vibration action helps to separate the parts during the plating process to prevent overlap together.
Saw Filter
WET AND DRY COMBINED DEPOSITION TECHNOLOGY
The combination of both wet and dry deposition technique, this unique technology is plating three layers on a non-metallic substrate, currently used in the semiconductor industry. This unique technology is a One-Stop plating services provided by Singapore Epson Industrial Plating Division.
A Vacuum deposition acts as a seed layer is plated on non-metallic surfaces to allow further surface processing. This combination tTechnology allows Singapore Epson Industrial Plating Division to provide customers with unique and customised plating solutions.
