A wide range of plating types are used in the electronics industry. These include gold, electrolytic and electroless nickel, palladium nickel, tin, and ENIG plating. These plating techniques are used in the production of such products as hard disks, probe testers, PCBs, battery contacts and resistors.

Plating for Ceramic Resistor

Multi-Layer Alloy Plating for functional resistive film. Superior Adhesion over Ceramics, Stable Plating Speed, Excellent Resistance Value Specifications Size: 1S，2S，3S，5S，12S Substrate: Ceramic Metallization: Ni-Cu Alloy Thickness: 6 - 30 µm Technical Challenges Multi-Layered Copper / Nickel Alloy Plating with High Adhesion and Resistance Properties. Plating on Resistor Please refer to the relevant pages Nickel Plating， Copper Plating

ENIG Plating for PCB Boards

As Electroless Ni-Au Substitute, ENIG Shows More Advantages. Mainly Used in Electronic Products, Wire Bonding and Solder Connections. Specifications Substrate: PCB Board，Copper Metallization: ENIG Thickness: Au: 0.05 - 0.1 µm Ni: >6 µm Technical Challenges Uneven Plating Surface, Short Lifespan and Treatment for EN Solutions, and Copper Contamination. High Precision Replenishment Column System for good chemical control process Auto Chemical Analysis and Control System for precision chemical control with Cpk above 1.33 Please refer to the relevant pages ENIG Plating

Plating for Flex Tapes

Reel-to-Reel FPC Conducting Continuous Plating has Broad Prospects for Development of Surface Treatment Technology and Solutions. Developed Electrolytic Tin to Replace Immersion Tin on Flex Tape, it has Better Quality and Reduced Tin Whiskers. Specifications Substrate: Polyimide Metallization: Electrolytic Tin Thickness: 0.2 ~ 0.5 µm Technical Challenges Reduced Uneven Plating Surface, Improving Chemical Lifespan and Reduced Copper Contamination. Sn Lump Inside Bump is <5 µm No Whiskers Found More Than 4 Months Please refer to the relevant pages Tin Plating

Plating for Hydrodynamic Bearing
	Plating Done For Spindle Motor of Computer Hard Disks. Specifications Size: 0.85", 1.0", 1.8", 2.5", 3.5" Substrate: Ceramic Metallization: EN Thickness: Controlled within 20nm Technical Challenges Precise Plating Thickness Controlled in Nano-meter Plated Area Please refer to the relevant pages Nickel Plating