![Epson Plating Division - Electronics Industry Epson Plating Division - Electronics Industry](../images/electronics/industry-tab_electronics.jpg)
A wide range of plating types are used in the electronics industry. These include gold, electrolytic and electroless nickel, palladium nickel, tin, and ENIG plating. These plating techniques are used in the production of such products as hard disks, probe testers, PCBs, battery contacts and resistors.
Plating for Ceramic Resistor |
![Epson Plating Division - Electronics Industry Epson Plating Division - Electronics Industry](../images/electronics/elec_resistor.jpg) |
Multi-Layer Alloy Plating for functional resistive film. Superior Adhesion over Ceramics, Stable Plating Speed, Excellent Resistance Value
Specifications |
Size: |
1S,2S,3S,5S,12S |
Substrate: |
Ceramic |
Metallization: |
Ni-Cu Alloy |
Thickness: |
6 - 30 µm |
Technical Challenges |
Multi-Layered Copper / Nickel Alloy Plating with High Adhesion and Resistance Properties. |
![Epson Plating Division - Electronics Industry Epson Plating Division - Electronics Industry](../images/electronics/elec_resis_03en.jpg) Plating on Resistor |
Please refer to the relevant pages Nickel Plating, Copper Plating
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Plating for Hydrodynamic Bearing |
![Epson Plating Division - Electronics Industry Epson Plating Division - Electronics Industry](../images/electronics/elec_hdd_main.jpg) |
Plating Done For Spindle Motor of Computer Hard Disks.
Specifications |
Size: |
0.85", 1.0", 1.8", 2.5", 3.5" |
Substrate: |
Ceramic |
Metallization: |
EN |
Thickness: |
Controlled within 20nm |
Technical Challenges |
Precise Plating Thickness Controlled in Nano-meter |
![Epson Plating Division - Electronics Industry Epson Plating Division - Electronics Industry](../images/electronics/elec_hdd_steps.jpg) Plated Area |
Please refer to the relevant pages Nickel Plating
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