GOLD TIN PLATING
Gold Tin (Au80Sn20) Alloy Plating
Gold Tin (AuSn) solder, a cornerstone in electronic soldering, offers versatility in application through methods like preform, solder paste, sequential evaporation, and electro-deposition. Our specialized electroplating process stands out as a cost-effective solution, delivering unparalleled thickness and positional control, with superior bonding reliability, wettability, and creep resistance.
Application:
- Die attach material.
- Chip bonding material for optoelectronic/microelectronic devices. /li>
- Lids for package sealing (hybrid, photonic, microelectronic & photo electronic device etc.)
![Properties](../images/GoldTin/GTProperties.png)
Wafer Level Plating Technology Eutectic Gold Tin (AuSn)
Alloy solder is used to solder IC chips to substrate for hermetic packaging assembly with Excellent bonding reliability, wettability, creep resistance.
![Features](../images/GoldTin/features.png)
![Plating Method](../images/GoldTin/platingmethod.png)
![Detail](../images/GoldTin/Detail.png)
Related words:
Gold Tin Plating, Au80Sn20 Alloy, Electronic Soldering, Electroplating Process, Wafer Level Plating Technology