Gold Tin (Au80Sn20) Alloy Plating

Gold Tin (AuSn) solder, a cornerstone in electronic soldering, offers versatility in application through methods like preform, solder paste, sequential evaporation, and electro-deposition. Our specialized electroplating process stands out as a cost-effective solution, delivering unparalleled thickness and positional control, with superior bonding reliability, wettability, and creep resistance.



  • Die attach material.
  • Chip bonding material for optoelectronic/microelectronic devices. /li>
  • Lids for package sealing (hybrid, photonic, microelectronic & photo electronic device etc.)
  • Properties


    Wafer Level Plating Technology Eutectic Gold Tin (AuSn)

    Alloy solder is used to solder IC chips to substrate for hermetic packaging assembly with Excellent bonding reliability, wettability, creep resistance.

    Features Plating Method Detail


Related words:

Gold Tin Plating, Au80Sn20 Alloy, Electronic Soldering, Electroplating Process, Wafer Level Plating Technology

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