![Epson Plating Division Semiconductor Industry Epson Plating Division Semiconductor Industry](../images/semiconductor/industry-tab_semicon.jpg)
In the semiconductor industry, gold and electroless nickel plating are applied to reflector rings, reflector arrays and top chucks. Gold is used because of its reflectivity, conductivity and heat dissipation qualities. Electroless nickel is valued for its evenness and chemical resistance.
Under Bump Metalisation (UBM) |
![LED Bulb UBM](../images/semiconductor/semicon_ubm.jpg) |
For Connecting a Semiconductor Device to the Packaging Substrate.
Specifications |
Size: |
4", 6", 8" (Round Wafer) |
Substrate: |
Ceramic, Al-Si |
Metallization: |
Ti, Cu, Ni, Au, Ag, Cr |
Technical Challenges |
To Provide Excellent Adhesion to Variety of Wafers. |
Metal Diffusion Prevention. |
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Plating Technology for Wafers |
![LED Bulb LED Bulb](../images/semiconductor/semicon_wafer_rd.jpg) |
Used in LEDs and Semiconductor Wafers in wireless mobile telecommunications technology.
Specifications |
Size: |
3", 4", 5", 6", 8" (Round Wafer) 4" (Square Wafer) |
Substrate: |
Ceramic, Al-Si |
Metallization: |
Au, Black Ni, Au-Sn, Au-Ni, Si, Cu |
Thickness: |
0.1 - 100µm |
Technical Challenges |
Encapsulation Plating on SAW Devices Copper / Black Nickel Multilayer Plating on (CSSP SAW) Filters Challenges Encapsulate over the Package, Protecting Against Humidity, Electromagnetic Induction and oxidation. Intensity of Black is Required as A Detector in Laser Marking. |
Cu Plating on SAW Devices Copper Plating on SAW Filters Even Thickness Distribution |
Au-Sn Alloy Plating On Wafer Limited Chemical Life Span, Color and Composition uniformity |
Wafer Au Plating Adhesion on Si/Al Alloy Materials, Surface Roughness Improvement on Roughness and Adhesion using PVD and Electroplating. |
![LED Bulb LED Bulb](../images/semiconductor/semi_130x130_bknien.jpg) 3 Layer Plating on Surface of SAW Device |
![LED Bulb LED Bulb](../images/semiconductor/semi_130x130_cuen.jpg) Copper Plating on SAW Filter |
![LED Bulb LED Bulb](../images/semiconductor/semi_130x130_ausn.jpg) Low Melting Point(280°C – 300°C) |
![LED Bulb LED Bulb](../images/semiconductor/semi_130x130_aurough.jpg) Good Surface Roughness of Ra = <0.05µm |
Please refer to the relevant pages Gold Plating,Nickel Plating,Copper Plating,Tin Plating
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Plating Technology for RF Packages |
![LED Bulb Base Station](../images/semiconductor/semicon_satellite.jpg) |
RF Packages in Satellites, Base Stations and Other Communication Devices
Specifications |
Substrate: |
Ceramic, Cu-Mo, Cu, Cu-W |
Metallization: |
Ni-Co / Au |
Thickness: |
1.5 - 3.5µm |
Technical Challenges |
![RFP Semiconductor LED Bulb](../images/semiconductor/rfp_satellite_chip_en.jpg) Chip is directly connected to the base |
Plate uniform Au (Ni±0.9μm Au±0.23μm)on 2 different thickness parts which separated by Ceramic. Selective Lids Plating on New Models of Holy Lids and Ceramics |
Please refer to the relevant pages Gold Plating,Nickel Plating,Copper Plating
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