Epson

Singapore Epson Industrial Plating Division offers unique plating technology for various industries. Each plating method is customised to meet various sizes of different parts. Because we follow strict specifications according to customer requirements with our advanced technology, this is how we differentiate ourselves and in the operation process reducing harmful effects to the environment.

Read how we managed to reduced harmful environmental effects here

Microfabrication

Microfabrication by Photo Chemical Etching Process is a highly precise, tightly controlled corrosion process used to produce complex metal components with very fine detail. One-Stop Service- From Material, Design, Tooling, Downset Forming, Singulation to Final Product Epson drives to diversity into another novel business penetration, Chemical Machining, Selective Metal Coating, Lift-off Coating to create one stop services. Process Flow and Capabilities

DLC Coating

DLC -Diamond Like Carbon Coating                                                                                                 Blades, drill bits and mould

By applying filtered cathodic vacuum arc technology, this machine can deposit DLC(Diamond Like Carbon) coating with extreme hardness and low friction for superior wear resistance, which can be applied to prolong lifespan for cutting tools, gears, shaft bearings, mould etc. DLC coating can also be applied for decoration coating like watch bands, watches cases. DLC Coating– Specification Coating Specification :- 1. Coating layer: interlayer + DLC or multi DLC layer etc. 2. DLC Hardness : 1500 ~ 6000 HV 3. Coating thickness: 0.5 um ~2um 4. Low friction coefficient Application: 1. Black coating for watch bands, watch case etc 2. Super hard DLC coating (6000HV) for cutting tools, drill bits and mould etc. 3. Super hard DLC coating for mechanical parts like gears, shaft bearings DLC Coating– Benefits 1. Able to deposit DLC coating with extreme hardness and low friction coefficient for excellent wear resistance 2. Able to deposit DLC coating with excellent adhesion by introducing interlayers or optimizing DLC coating structures DLC Machine

Multi-Target Sputtering

Sputtering

The Multi-target sputtering system designed with multi-targets (4 targets) inside the process chamber, suitable for R&D, prototype sputtering or small scale production for wafer and panel products. Machine is also configured with a load lock, which enable users to load/unload products without breaking the vacuum of process chamber Multi-Target Sputtering– Specification Coating Specification :- 1. Coating material: Ti, Cu, Al, Ni, TiW, Ta, Cr etc. 2. Maximum heating temperature (500°C ± 1%) 3. Sputtering layer thickness uniformity ± 5% Application: 1. Metal layer sputtering for wafer and panel products 2. Hole filling for wafer and panel products 3. Reactive sputtering for dielectric thin film layer for wafer and panel products Multi-Target Sputtering– Benefits 1. Suitable for multilayer sputtering without breaking vacuum (4 targets in chamber) 2. Equipped with high-magnetic cathode plate to sputter Ni and other ferromagnetic material 3. High flexibility for different product size or coating specification Multi-target Sputtering Machine

Barrel Sputtering

Loading                                Sputtering                                Unloading

The barrel sputtering machine is designed with a rotating barrel in which products are loaded for sputtering process. The barrel sputtering process enables high loading quantity and great productivity for loose/small size metallisation. Barrel Sputtering– Specification Coating Specification :- 1. Coating material: Ti, Cr, Cu, Ni, SUS… 2. Maximum heating temperature: 300°C 3. Residual gas analyser: ULVAC CGM Application: 1. Metallization for ceramic rod 2. Metallization of ceramic or other material products with small part size Barrel Sputtering– Benefits 1. High productivity and loading volume for metallization of small size product such as ceramic rod 2. Metallization layer with excellent electronic functional performance compared with wet plating 3. Good thickness uniformity Barrel Sputtering Machine

Vibratory Plating

Vibro-Barrel

We offers vibratory plating service to bulk process delicate work piece as alternative to barrel plating. Vibratory plating is designed to prevent entanglement, deformation, scratches and other mechanical defects on work piece. It is commonly employed in plating of pin, switch, connector and terminal. Plating finishes available including nickel, silver, palladium and gold. Vibro-Barrel – Concept A vibration generator transmits oscillation pulses to the basket through the vertical shaft. This vibration causes the parts to move slowly around the basket’s axis while gently being mixed and agitated. The parts move over rows of cathode contact that located at the bottom of the basket, while maintaining electrical contact at all times. There are plastic screens located at the bottom of the basket, which allow exchange of chemical solution. Thus, ensure constant current density and uniform plating. Vibro-Barrel – Benefits Reduces precious metal consumption  The vibratory action helps to dislodge trapped solution from the plated parts decreasing the amount of drag-out and increasing the effectiveness of the rinse cycles. Eliminates part damage  A wide variety of part sizes and types can be plated in these units. The gentle vibratory action reduces tangling and protects small delicate parts from being bent, scratched, or otherwise damaged. Minimizes drag-out  The vibratory action helps to dislodge trapped solution from the plated parts decreasing the amount of drag-out and increasing the effectiveness of the rinse cycles. Vibration improve parts lapping defects  The vibration action helps to separate the parts during the plating process to prevent overlap together. Vibro-Barrel Plating Line

Selective Plating Technology

Reusable, Easy Handling Masking Used During Plating Process.

The main use of selective plating is to focus plating on the functional area, thus bringing down plating costs. The area of a part not to be plated is masked so that it is not plated. Epson is currently providing two types of selective plating: nickel and silver. We also work closely with our customers to provide customized solutions that meet and exceed their expectations. r Selective Nickel Plating Selective nickel plating is used for high-pressure turbine support assemblies, which are plated at a minimum thickness of 500µm. Unplated areas are masked with masking tape during the plating process. Main Application/Advantages Epson has developed a new plating production line concept that reduces the time taken from days to hours, uses a smaller solution tank and delivers better quality. Please refer to the relevant pages Aerospace Industry，Nickel Plating Non-Bath Selective Plating (NBS) Non-bath selective plating (NBS) is performed using Epson's self-designed machine, which has a solution agitation system specialized for selective plating. The internal diameter of the part to be plated is used as a bath, while any non-plated areas are covered with a rubber mask. The bath level is automatically controlled and the loading jig and rubber mask are specially designed to cater to different sizes. Main Application/Advantages NBS is used for selective silver plating. Using this method allows the special anode to control the distribution of the plating thickness, from 1~50 µm. NBS also helps to conserve chemicals and energy, thus making it environmentally friendly. Please refer to the relevant pages Oil and Gas Industry，Silver Plating

Wet and Dry Combined Deposition Techology

Three Layered Plating

The combination of both wet and dry deposition technique, this unique technology is plating three layers on a non-metallic substrate, currently used in the semiconductor industry. This unique technology is a One-Stop plating services provided by Singapore Epson Industrial Plating Division. A Vacuum deposition acts as a seed layer is plated on non-metallic surfaces to allow further surface processing. This combination tTechnology allows Singapore Epson Industrial Plating Division to provide customers with unique and customised plating solutions. Please refer to the relevant pages Semiconductor Industry

Waste Water Reycling System

Plating can be used in a variety of environmental control systems related to waste water treatment, including DI systems and water recycling systems. Epson's cyanide treatment line is used to treat all cyanide, gold and alkaline waste from production, and can treat approximately 222m3 of waste daily. Epson also has a heavy metal treatment line to treat all metallic and acidic production waste, and can treat approximately 278m3 of waste daily. These systems allow users to maintain trade effluent treatment facilities in good order and allow for quality trade effluent that exceeds PUB's regulatory and environmental requirements. Epson is working to improve the current chemical coagulation to electro-coagulation method for waste water treatment in order to minimise chemical usage and waste. Another system that Epson has developed is the DI system, which has been used as the feed source for water generation. The system is able to generate three different types of DI water (RO, LP and HP) to meet production needs using Ultra Filtration and an RO system. The DI system can produce approximately 528m3 with less than 20us of quality water daily to ensure an uninterrupted quantity and quality of DI water supply. -> µS (micro Siemens) Epson's in-house water recycling system has proved to be a cost-effective and efficient way to reduce our water consumption. The system minimises chemical usage and the strain on natural resources, conforming to Seiko Epson's environmental policies and focus on water conservation. The result has been an approximately 40% recycling rate for production waste water. In addition, we also have a rainwater collection project in place. Epson is currently working to achieve zero trade effluent discharge by recycling all effluent. Operation Process