| ICP ATOMIC EMISSION SPECTROMETERS | GLOW DISCHARGE PROFILER | XRF THICKNESS COATING GUAGE | ELECTRON DISPERSION |

 

 

ICP ATOMIC EMISSION SPECTROMETERS

ICP
Simultaneous ICP atomic emission spectrometers are next-generation systems that offer the superior accuracy necessary to simultaneously and quickly analyse multiple elements regardless of their concentration levels. They also feature user-friendly software that makes analysis easy. It represent the ultimate in ICP atomic emission spectrometry for environmental, pharmaceutical, food, chemical, metal, and other fields 

Specifications

RF Generator Frequency: 27MHz
RF Power: Max. 1.6kW (0.2 kW step)
RF Device: Transistor
Output Stability: Within ± 0.3%
Efficiency: 75% or better
Spectrometer Echelle Optics:
  Range of wavelength: 167nm to 800 nm
Dispersion elements:
  Echelle grating 79 line/mm
  Prism
Reciprocal dispersion:
  0.21 nm/mm at 200 nm
  0.68 nm/mm at 600nm
Resolution:
  ≤ to 0.005 nm at 200nm
Temperature:
  termal controller (38 ℃ )
Atmospheric removal system:
  Rotary vacuum pump ≤ 10 Pa
Device CCD (charge coupled device) detector
Pixel number:   1024 x 1024 pixels (1-inch)
Pixel size:   20μm x 20μm
Cooling control:Peltier device

 

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GLOW DISCHARGE PROFILER Glow Discharge Profiler

Radio Frequency-Glow Discharge-Optical Emission Spectrometry (RF-GD-OES) from HORIBA can be used on both conductive and non-conductive materials. It can also analyze materials with even surfaces with diameters greater than 4mm. In total, 43 elements, including H, O, N, C and Cl, can be determined by using glow discharge (GD).

 

Main Application/Advantages

  • The main applications of GD analysis are for surface analysis, bulk analysis and depth profile analysis. For example, GD can be used to profile a Zn-Ni coating.

 

Specification

Resource Radio Frequency
Detector Optical Emission Spectrometer
Sample Shape Plain, Diameter ≥ 4mm
Detection Limit ppm (mg/L)

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XRF THICKNESS COATING GAUGE XRF Thickness Coating Guage

The XRF Thickness Coating Gauge uses a sensitive, non-contact, and non-destructive method to measure the coating thickness for metallic and non-metallic materials over a range of thicknesses, from as little as 0.05 μm to as much as 70 μm depending on the coating materials.

Main Application/Advantages


The thickness gauge is widely used to determine:

  • The thickness of coated materials

  • Elements through spectrum matching

  • Thickness of material in cavities

  • Metallic elements in solutions

Advantages of this gauge include:

  • One-touch focusing operation with laser focus mechanism

  • Automatic measurement functions

  • Thin Film FP software (capable of a wide range of applications including multiple coated layers and Pb free allow coatings)

  • Report creation software (prints out a report of measurement results through macro-enhanced software)

  • Fast, reliable and accurate measurement

    Specifications

    • Able to determine at least 35 types of electroplated layers; i.e. Au, Ag, Pd, Pd-Ni, Ni-B, Ni-Co, etc.

    • Measures over a wide spectrum of elements from titanium to bismuth

    • Collimator size as small as 0.05mm for smaller measurement areas

 

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ELECTRON DISPERSION

Please refer to Scanning Electron Microscope


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