Plating Specifications
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Plating Specifications
Properties |
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Plating capability |
Specification |
Appearance |
Purity (%) |
Hardness (Hv) |
Solderability |
Conductivity |
Ductility |
|
Gold |
Soft Gold |
ASTM B448 |
ⓜ |
99.99 |
< 76 |
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Hard Gold |
MIL-G-45204 |
Ⓑ |
99.95 |
116~188 |
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Pink Gold |
-- |
Ⓑ |
65~70 |
> 120 |
-- |
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Silver |
Bright Silver |
AMS 2411D, ASTM B70, SPOP 240 |
Ⓑ |
99.90 |
120~150 |
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Palladium |
Palladium |
ASTM B679 |
Ⓑ |
99.90 |
350~400 |
-- |
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Palladium Nickel |
ASTM B867 |
Ⓑ |
80/20 |
460~505 |
-- |
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Electroless Nickel |
Low phosphorous |
ASTM B656 |
Ⓑ |
1~4 (P) |
586~714 |
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Medium phosphorous |
ASTM B656 |
Ⓑ |
5~9 (P) |
~500 |
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High phosphorous |
ASTM B656, SPOP 311 |
Ⓑ |
> 10 (P) |
500~600 |
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Boron |
ASTM B607 |
-- |
~1 (B) |
~700 |
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Electrolytic Nickel |
Bright Nickel |
ASTM B689, QQ-N-290A |
Ⓑ |
99.90 |
180~405 |
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Sulphamate Nickel |
ASTM B689, ISO 1458 & QQ-N-290A, SPOP 26 |
Ⓑ |
99.90 |
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Watts Nickel |
ASTM B689, QQ-N-290A |
ⓜ |
100.00 |
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Black Nickel |
AMS 2417, MIL-P-18317 |
ⓜ |
-- |
-- |
-- |
-- |
-- |
|
Tin |
Bright Tin |
ASTM B545, ASTM B579 & MIL-P-81728 |
Ⓑ |
100.00 |
20~30 |
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Dull Tin |
ⓜ |
100.00 |
-- |
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Chrome |
Hard Chrome |
SPOP 22 |
Ⓑ |
-- |
800-1000 |
-- |
-- |
-- |
Copper |
Copper |
ASTM B734 |
ⓜ |
100.00 |
-- |
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Physical Vapour Deposit |
Gold |
WST.P-104, WST.P-105 |
Ⓑ |
-- |
Increase hardness of parent material by 50% |
-- |
-- |
-- |
Silver |
WST.P-104, WST.P-105 |
Ⓑ |
-- |
-- |
-- |
-- |
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Black |
WST.P-104, WST.P-105 |
Ⓑ |
-- |
-- |
-- |
-- |
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DLC |
ASTM G171 |
Ⓑ |
-- |
-- |
-- |
-- |
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Anti-Reflective |
MIL-C-14806 Rev.A |
Ⓑ |
-- |
-- |
-- |
-- |
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Titanium Copper |
MIL-T-9046 |
Ⓑ |
-- |
-- |
-- |
-- |
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Silicon |
MIL-STD-202 |
Ⓑ |
-- |
-- |
-- |
-- |
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| Surface Treatment | Specification | Other Services |
| Heat treatment (Quenching and Annealing) | -- | Research and Development |
| Mechanical/ Chemical/ Electrolytic Polishing | -- | Process / Customization |
| Plasma Stripping | SPOP 301 | One Stop Service |
| Alkaline Stripping | SPOP 5 | Failure Analysis |